scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 OP249A Dual precision JFET, high speed operational amplifier

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 Can P GDIP1-T8 or CDIP2-T8 8 Dual-in-line package 2 CQCCl-N20 20 Square chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_S) - - - - - - - - - - - - - - - - - - - - - - - - ±18 V dc Differential input voltage (V_ID)- - - - - - - - - - - - - - - - - - - 36 V dc 2/ Input voltage (V_IN) - - - - - - - - - - - - - - - - - - - - - - - - - Supply voltage 2/ Output short circuit duration - - - - - - - - - - - - - - - - - - - - Indefinite Storage temperature range - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature range (soldering, 60 seconds) - - - - - - - - - - - +300°C Power dissipation (P_D) - - - - - - - - - - - - - - - - - - - - - - - 500 mW Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - - +175°C Thermal resistance, junction-to-case (θ_JA) - - - - - - - - - - - - - See MIL-STD-1835 Thermal resistance, junction-to-ambient (θ_JA): Case G - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 145°C/W Case P - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 134°C/W Case 2 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 88°C/W

Supply voltage (V_S) - - - - - - - - - - - - - - - - - - - - - - - - - ±15 V dc Ambient operating temperature range (T_A) - - - - - - - - - - - - - - - −55°C to +125°C

intended Use: