scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 8K × 8 UV EPROM 45 ns 02 8K × 8 UV EPROM 55 ns 03 8K × 8 UV EPROM 70 ns 04 8K × 8 UV EPROM 90 ns 05 8K × 8 UV EPROM 45 ns 06 8K × 8 UV EPROM 55 ns 07 8K × 8 UV EPROM 35 ns 08 8K × 8 UV EPROM 35 ns 09 8K × 8 UV EPROM 45 ns 10 8K × 8 UV EPROM 55 ns 11 8K × 8 UV EPROM 25 ns 12 8K × 8 UV EPROM 25 ns

The case outline(s) shall be as designated in MIL-STD-1835, and as follows:

Outline letter Descriptive designator Terminals Package style J GDIP1-T24 OR CDIP2-T24 24 Dual-in-line 2/ K GDFP2-F24 OR CDFP3-F24 24 Flat pack 2/ L GDIP3-T24 OR CDIP4-T24 24 Dual-in-line 2/ 3 CQCC1-N28 28 Square leadless chip carrier 2/

The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature - - - - - - - - - - - - - - - −65°C to +150°C Voltages on any pin with respect to ground- - - - −0.5 V dc to +7.0 V dc V_PP with respect to ground- - - - - - - - - - - - −0.5 V dc to +14.0 V dc Maximum power dissipation (P_D) 3/ - - - - - - - - 1 W Lead temperature (soldering, 10 seconds)- - - - - +300°C Thermal resistance, junction-to-case (θ_JC)- - - - MIL-STD-1835 Junction temperature (T_J) 4/- - - - - - - - - - - +150°C

Case operating temperature (T_C) - - - - - - - - - −55°C to +125°C Supply voltage (V_CC)- - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc

intended Use: