scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 AD7710 Signal conditioning A/D converter

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

AV_DD to DV_DD.................................... −0.3 V dc to +12 V dc AV_DD to V_SS..................................... −0.3 V dc to +12 V dc AV_DD to AGND.................................... −0.3 V dc to +12 V dc AV_DD to DGND.................................... −0.3 V dc to +12 V dc DV_DD to AGND.................................... −0.3 V dc to +6 V dc DV_DD to DGND.................................... −0.3 V dc to +6 V dc V_SS, to AGND.................................... +0.3 V dc to −6 V dc V_SS, to DGND.................................... +0.3 V dc to −6 V dc Analog input voltage to AGND.................... V_SS −0.3 V dc to AV_DD + 0.3 V dc Reference input voltage to AGND................. V_SS −0.3 V dc to AV_DD + 0.3 V dc REF OUT to AGND................................. −0.3 V dc to AV_DD Digital input voltage to DGND................... −0.3 V dc to AV_DD + 0.3 V dc Digital output voltage to DGND.................. −0.3 V dc to DV_DD + 0.3 V dc Storage temperature range....................... −65°C to + 150°C Lead temperature (soldering, 10 secs)........... +265°C Power dissipation to +75°C (P_D) 2/.............. 450 mW

Ambient operating temperature range..................−55°C to +125°C

intended Use: