DLA - SMD-5962-88767
MICROCIRCUIT, LINEAR, MULTIPLYING, 12-BIT, DIGITAL-TO-ANALOG CONVERTER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 20 December 1993 |
| Status: | inactive |
| Page Count: | 10 |
scope:
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Relative Accuracy (INL) 01 MAX502A 12-bit multiplying D/A converter ±0.5 LSB 02 MAX502B 12-bit multiplying D/A converter ±0.75 LSB
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . −0.3 V dc, +17 V dc VSS to DGND . . . . . . . . . . . . . . . . . . . . . . +0.3 V dc, −17 V dc VREF to AGND . . . . . . . . . . . . . . . . . . . . . ±25 V dc RFB to AGND . . . . . . . . . . . . . . . . . . . . . . ±25 V dc RA to AGND . . . . . . . . . . . . . . . . . . . . . . ±25 V dc RB to AGND . . . . . . . . . . . . . . . . . . . . . . ±25 V dc RC to AGND . . . . . . . . . . . . . . . . . . . . . . ±25 V dc VOUT to AGND 1/ . . . . . . . . . . . . . . . . . . . . VDD +0.3 V dc, VSS −0.3 V dc VDD to AGND . . . . . . . . . . . . . . . . . . . . . . −0.3 V dc, +17 V dc AGND to DGND . . . . . . . . . . . . . . . . . . . . . −0.3 V dc, VDD Digital input voltage to DGND . . . . . . . . . . . . . −0.3 V dc, VDD Power dissipation (PD), TA = 75°C 2/ . . . . . . . . . 650 mW Lead temperature (soldering, 10 seconds) . . . . . . . +300°C Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C
Positive supply voltage (VDD) . . . . . . . . . . . . . +11.4 V dc to +15.75 V dc Negative supply voltage (VSS) . . . . . . . . . . . . . −11.4 V dc to −15.75 V dc Ambient operating temperature range . . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Document History
