scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 7B923 High-speed optical/copper transmitter interface

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style 3 CQCC2-N28 28 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) to ground potential continuous ------------------------ −0.5 V to +7.0 V DC voltage range applied to output ---------------------- −0.5 V to V_CC maximum DC input voltage range ---------------------------------- −0.5 V to +7.0 V DC output current (TTL LOW) ----------------------------- 30 mA DC output current (PECL HIGH) --------------------------- −50 mA DC input current ---------------------------------------- −30 to +0.5 mA Storage temperature range ------------------------------- −65°C to +150°C Maximum power dissipation (P_D) 2/ ----------------------- 1.0 W Lead temperature (soldering, 10 seconds) ---------------- 260°C Thermal resistance, Junction to case (θ_JC) -------------- See MIL-STD-1835 Junction temperature (T_J) ------------------------------- 155°C

Supply voltage range (V_CC) ------------------------------ +4.5 V dc to +5.5 V dc Minimum high-level input voltage (V_IH) (CKW and FOTO) -------------------------------------- 2.2 V (Others) -------------------------------------------- 2.0 V Maximum low-level input voltage (V_IL) ------------------- 0.8 V Case operating temperature range ------------------------ −55°C to + 125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) -------------- XX percent 3/

intended Use: