scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 PAL16L8-20 16-input 8-output AND-OR invert gate array 02 PAL16R8-20 16-input 8-output registered AND-OR gate array 03 PAL16R6-20 16-input 6-output registered AND-OR gate array 04 PAL16R4-20 16-input 4-output registered AND-OR gate array 05 PAL16L8-30 16-input 8-output AND-OR invert gate array 06 PAL16R8-30 16-input 8-output registered AND-OR gate array 07 PAL16R6-30 16-input 6-output registered AND-OR gate array 08 PAL16R4-30 16-input 4-output registered AND-OR gate array 09 PAL16L8-15 16-input 8-output AND-OR invert gate array 10 PAL16R8-15 16-input 8-output registered AND-OR gate array 11 PAL16R6-15 16-input 6-output registered AND-OR gate array 12 PAL16R4-15 16-input 4-output registered AND-OR gate array 13 PAL16L8A-12 16-input 8-output AND-OR invert gate array 14 PAL16R8A-12 16-input 8-output registered AND-OR gate array 15 PAL16R6-12 16-input 6-output registered AND-OR gate array 16 PAL16R4-12 16-input 4-output registered AND-OR gate array 17 PAL16L8-10 16-input 8-output AND-OR invert gate array 18 PAL16R8-10 16-input 8-output registered AND-OR gate array 19 PAL16R6-10 16-input 6-output registered AND-OR gate array 20 PAL16R4-10 16-input 4-output registered AND-OR gate array

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package S F-9 (20-lead, .540" × .300" × .100"), flat package 2 C-2 (20-terminal, .358" × .358 × .100"), square chip carrier package

Supply voltage range 1/ - - - - - - - - - - - - - - - −0.5 V dc to 7.0V dc Input voltage range 1/ 2/ - - - - - - - - - - - - - - −0.5 V dc to 5.5 V dc Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - +260°C Thermal resistance, junction-to-case (θ_JC) 3/- - - - - See MIL-M-38510, appendix C Applied voltage to a disabled output range 1/ 2/ - - - −0.5 V dc to 5.5 V dc Maximum power dissipation (P_D) 4/: Device types 01, 02, 03, and 04 - - - - - - - - - - 1.1 W Device types 05, 06, 07, and 08 - - - - - - - - - - 0.6 W Device types 09, 10, 11, 12, 13, 14, and 15 - 20 - - 1.2 W Maximum junction temperature (T_J) - - - - - - - - - - +175°C

Supply voltage range (V_CC) - - - - - - - - - - - - - - 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (V_IH) - - - - - - - - 2.0 V dc Maximum low level input voltage (V_IL) - - - - - - - - 0.8 V dc Maximum high level output current (I_OH) - - - - - - - −2.0 mA dc Maximum low level output current (I_OL) - - - - - - - - 12.0 mA dc Case operating temperature range - - - - - - - - - - - −55°C to +125°C

intended Use: