scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 16 M × 1, DYNAMIC RAM, 32 ms refresh 100 ns 02 16 M × 1, DYNAMIC RAM, 32 ms refresh 80 ns 03 16 M × 1, DYNAMIC RAM, 32 ms refresh 70 ns

The device class designator shall be a single letter identifying the product assurance level (see 6.7 herein) as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 28 flat pack Y See figure 1 28/24 leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Voltage range on any pin - - - - - - - - - - - - - - - - - - - - - −1 V dc to 7 V dc Voltage range on V_CC - - - - - - - - - - - - - - - - - - - - - - - −1 V dc to 7 V dc Short circuit output current - - - - - - - - - - - - - - - - - - - 50 mA Maximum power dissipation (P_D) - - - - - - - - - - - - - - - - - - 1 W Storage temperature range - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) Case outlines X and Y - - - - - - - - - - - - - - - - - - - - - 15°C/W 3/ Junction temperature (T_J) 4/ - - - - - - - - - - - - - - - - - - - +175°C

Supply voltage range (V_CC) 5/ - - - - - - - - - - - +4.5 V dc to +5.5 V dc High-level input voltage (V_IH) - - - - - - - - - - - 2.4 V dc minimum to 6.5 V dc maximum Low-level input voltage (V_IL) 6/ - - - - - - - - - −1.0 V dc minimum to 0.8 V dc maximum Case operating temperature range (T_C) - - - - - - - −55°C to +125°C Transition times, [R bar][A bar][S bar] and [C bar][A bar][S bar] (rise and fall) - - - 3 ns minimum to 30 ns maximum

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - 7/ percent

intended Use: