scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 SPT5140 High speed, 385 MWPS, video 8-Bit D/A converter

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltages: V_EED (measured to V_CCD) ............................. −7.0 to +0.5 V dc V_EEA (measured to V_CCA ............................. −7.0 to +0.5 V dc V_CCA (measured to V_CCD) ............................. −0.5 to +0.5 V dc Input voltages: CONV, data and controls (measured to V_CCD) .......... V_EED to +0.5 V dc Ref⁺ (measured to V_CCA) ............................. V_EEA to +0.5 V dc Ref⁻ (measured to V_CCA) ............................. V_EEA to +0.5 V dc Junction temperature (T_J) ............................. +175°C Lead temperature (soldering, 10 seconds) .............. +300°C Storage temperature ................................... −60°C to +150°C

Ambient operating temperature range ........... −55°C to +125°C Supply voltage range (V_EEA, V_EED) ............. −4.9 V dc to −5.5 V dc

intended Use: