IPC - TM-650 2.4.34.1
Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centerpoise)
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | active |
| Page Count: | 2 |
scope:
This test specifies a standard procedure for determining the viscosity of solder paste in the range of 50,000 to 300,000 centipoise.
Document History
TM-650 2.4.34.1
January 1, 1995
Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centerpoise)
This test specifies a standard procedure for determining the viscosity of solder paste in the range of 50,000 to 300,000 centipoise.