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IPC - J-STD-005

Requirements for Soldering Pastes

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Organization: IPC
Publication Date: 1 January 1995
Status: inactive
Page Count: 24
scope:

This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.

Document History

February 1, 2012
Requirements for Soldering Pastes
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
J-STD-005
January 1, 1995
Requirements for Soldering Pastes
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a quality control...

References

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