scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type identify the circuit function as follows:

Device type Generic number Circuit function 01 26C31 CMOS quad differential line driver

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack X See figure 1 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)................................−0.5 V dc to 7.0 V dc DC input voltage range (V_IN)..............................−0.5 V dc to V_CC + 0.5 V dc DC output voltage range (V_OUT)............................−0.5 V dc to 7.0 V dc DC output current, per pin (I_OUT).........................±150 mA Input, output clamp diode current (I_IK, I_OK)..............±20 mA DC V_CC or GND current, per pin (I_CC)......................±150 mA Storage temperature range.................................−65°C to + 150°C Lead temperature (soldering, 4 seconds)...................260°C Junction temperature (T_J).................................150°C Thermal resistance, junction-to-case (θ_JC): Cases E, F, 2...........................................See MIL-STD-1835 Case X..................................................11°C/W Thermal resistance, junction-to-ambient (θ_JA): Case E..................................................+100°C/W Case F..................................................+150°C/W Case X..................................................+116°C/W Case 2..................................................+85°C/W Power dissipation (P_D): (T_A = +25°C) Case E..................................................1375 mW Case F..................................................1000 mW Case X..................................................1293 mW Case 2..................................................1375 mW

Supply voltage range (V_CC)................................4.5 V dc to 5.5 V dc DC input or output voltage range (V_IN, V_OUT)..............0 V dc to Vcc Ambient operating temperature range (T_A)..................−55°C to +125°C

intended Use: