scope:

This drawing forms a part of a one part one, part number documentation system(see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and. lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes, M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 26C31 CMOS quad differential line driver

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-STD-38510 Q or V Certification and qualification to MIL-STD-38535

For device classes, M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package F F-5 (16-lead, .440" × .285" × .085"), flat package 2 C-2 (20-terminal, .358" × 358" × .100"), chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-1-38555 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC)- - - - - - - - - - - - - - - - −0.5 V dc to 7.0 V dc DC Input voltage range (V_IN)- - - - - - - - - - - - - - - −1.5 V dc to V_CC +1.5 V dc DC output voltage range (V_OUT)- - - - - - - - - - - - - - −0.5 V dc to 7.0 V dc DC output current, per pin (I_OUT) - - - - - - - - - - - - ±150 mA Input, output clamp diode current (I_IK, I_OK)- - - - - - - ±20 mA DC V_CC or GND current, per pin (I_CC)- - - - - - - - - - - ±150 mA Storage temperature range - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 4 seconds) - - - - - - - - - 260°C Junction temperature (T_J) - - - - - - - - - - - - - - - - 150°C Thermal resistance, junction-to-case (θ_JC)- - - - - - - - See MIL-M-38510, appendix C Thermal resistance, junction-to-ambient (θ_JA): Case E- - - - - - - - - - - - - - - - - - - - - - - - - +100°C/W Case F- - - - - - - - - - - - - - - - - - - - - - - - - +150°C/W Case 2- - - - - - - - - - - - - - - - - - - - - - - - - +85°C/W Power dissipation (P_D): T_A = +25°C: Case E- - - - - - - - - - - - - - - - - - - - - - - - - 1500 mW Case F- - - - - - - - - - - - - - - - - - - - - - - - - 1000 mW Case 2- - - - - - - - - - - - - - - - - - - - - - - - - 1700 mW

Supply voltage range (V_CC) - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc DC Input or output voltage range (V_IN, V_OUT)- - - - - - - 0.V dc to V_CC Ambient operating temperature range (T_A) - - - - - - - - −55°C to +125°C

intended Use: