DLA - SMD-5962-92305 REV C
MICROCIRCUIT, MEMORY, DIGITAL, CMOS 10000 GATE PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 26 September 1995 |
| Status: | inactive |
| Page Count: | 35 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Access time 01 4010-10 10000 gate programmable array 10 ns 02 4010-6 10000 gate programmable array 6 ns 03 4010-5 10000 gate programmable array 4.5 ns
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X CMGA10-PN 191 1/ Pin grid array package Y see figure 1 196 Unformed-lead chip carrier Z CQCC1-F196 196 unformed-lead chip carrier
The Lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range to ground potential (VCC) . . . . −0.5 V dc to +7.0 V dc DC input voltage range (VIN) . . . . . . . . . . . . . −0.5 V dc to VCC + 5.0 V dc Voltage applied to three-state output (VIS) . . . . . −0.5 V dc to VCC + 5.0 V dc Thermal resistance, junction-to-case (ΘJC): Case outlines X, Y, and Z . . . . . . . . . . . . See MIL-STD-1835 Junction temperature (TJ) . . . . . . . . . . . . . . +150°C 3/ Lead temperature (soldering, 10 seconds) . . . . . . . +260°C Storage temperature range . . . . . . . . . . . . . . −65°C to +150°C
Supply voltage relative to ground (VCC) . . . . . . . +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) . . . . . . . . . . . . . . . . . 0 V dc Case operating temperature range (TC) . . . . . . . . −55°C to + 125°C
Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . 5/ percent
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit application (original equipment), design applications, and logistics purposes.
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