DLA - SMD-5962-89763 REV A
MICROCIRCUIT, LINEAR, DUAL, SPDT ANALOG SWITCH, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 4 November 1992 |
| Status: | inactive |
| Page Count: | 12 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and V) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 DG403 Dual. SPDT analog switch
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip
The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
V+ to V− - - - - - - - - - - - - - - - - - - - - 44 V dc Ground to V− - - - - - - - - - - - - - - - - - - 25 V dc VL to V− - - - - - - - - - - - - - - - - - - - - (GND − 0.3 V) to 44 V dc (VIN), (VS), (VD) 1/ -- - - - - - - - - - - - - −2 V to V+ (+2 V) or 30 mA, whichever occurs first
Current, continuous (any terminal) - - - - - - - 30 mA Current (S or D), pulsed 1 ms, 10% duty - - - - 100 mA Storage temperature range - - - - -- - - - - - - −65°C to +150°C Power dissipation (PD): 2/ Case E - - - - - - - - - - - - - - - - - - - - 900 mW Case 2 - - - - - - - - - - - - - - - - - - - - 750 mW Thermal resistance, junction-to-case (ΘJC) - - - See MIL-STD-1835 Junction temperature - - - - - - - - - - - - - - +175°C
Positive supply voltage (V+) - - - - - - - - - - +15 V dc
Negative supply voltage (V−) - - - - - - - - - - −15 V dc
Logic supply voltage (VL) - - - - - - - - - - - +5 V dc
Ambient operating temperature range - - - - - - −55°C to +125°C
Charge injection - - - - - - - - - - - - - - - - 60 pC
Crosstalk (channel-to-channel)
intended Use:
Microcircuits conforming to this drawing are intended for use fop Government microcircuit applications (original equipment), design applications, and logistics purposes.
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