IPC - TM-650 2.6.13
Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring
|Publication Date:||1 October 1985|
This test method will demonstrate a relative degree to which uncoated printed wiring boards are susceptible to dendritic growth due to the presence of ionic residues and condensed moisture. This test method is particularly suitable for printed wiring board manufacturing process control.