IPC - TM-650 2.6.13

Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring

active, Most Current
Organization: IPC
Publication Date: 1 October 1985
Status: active
Page Count: 2
scope:

This test method will demonstrate a relative degree to which uncoated printed wiring boards are susceptible to dendritic growth due to the presence of ionic residues and condensed moisture. This test method is particularly suitable for printed wiring board manufacturing process control.

Document History

TM-650 2.6.13
October 1, 1985
Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring
This test method will demonstrate a relative degree to which uncoated printed wiring boards are susceptible to dendritic growth due to the presence of ionic residues and condensed moisture. This test...

References

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