IPC-TR-476
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
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| Organization: | IPC |
| Publication Date: | 1 May 1997 |
| Status: | active |
| Page Count: | 22 |
scope:
This technical report discusses the reasons and the test methods available for electrically induced failures on printed wiring board surfaces and sub-surfaces caused by a combination of voltage potential, electrical field, temperature, humidity, and contamination.
Solid State electromigration is discussed to differentiate from electrochemical migration phenomena. This document does not cover non-electrically-dri
Document History
IPC-TR-476
May 1, 1997
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
This technical report discusses the reasons and the test methods available for electrically induced failures on printed wiring board surfaces and sub-surfaces caused by a combination of voltage...
September 1, 1977
How to Avoid Metallic Growth Problems on Electronic Hardware
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