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IPC - TM-650 2.6.14D

Solder Mask - Resistance to Electrochemical Migration

active, Most Current
Organization: IPC
Publication Date: 1 March 2007
Status: active
Page Count: 4
scope:

This test method is used to determine the ability of a polymer solder mask protective coating to withstand an environment conducive to electrochemical migration.

Document History

TM-650 2.6.14D
March 1, 2007
Solder Mask - Resistance to Electrochemical Migration
This test method is used to determine the ability of a polymer solder mask protective coating to withstand an environment conducive to electrochemical migration.
TM-650 2.6.14C
July 1, 2000
Resistance to Electrochemical Migration, Solder Mask
A description is not available for this item.
TM-650 2.6.14A
August 1, 1987
Resistance to Electromigration, Polymer Solder Mask
A description is not available for this item.

References

This document references:
IPC-SM-840 - Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
Published by IPC on December 1, 2010
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test...
This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
IPC-SM-840 - Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
Published by IPC on December 1, 2010
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test...
This document references:
IPC-TR-476 - Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
Published by IPC on May 1, 1997
This technical report discusses the reasons and the test methods available for electrically induced failures on printed wiring board surfaces and sub-surfaces caused by a combination of voltage...
This document is referenced by:
IEC PAS 61249-8-5 - Qualification and performance specification of permanent solder mask and flexible cover materials
Published by IEC on June 1, 2014
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask and cover material under evaluation with the...
This document is referenced by:
IPC-SM-817 - General Requirements for Dielectric Surface Mounting Adhesives
Published by IPC on December 1, 2014
This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the...
This document is referenced by:
IPC-FC-234 - Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
Published by IPC on November 1, 2014
This document provides guidelines for the use of PSAs in single or double sided flexible printed circuits (see Figures A2 through A8), membrane switches (see Figures A9 through A12) and component...
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