IPC - TM-650 2.6.14A
Resistance to Electromigration, Polymer Solder Mask
inactive
| Organization: | IPC |
| Publication Date: | 1 August 1987 |
| Status: | inactive |
| Page Count: | 2 |
Document History
March 1, 2007
Solder Mask - Resistance to Electrochemical Migration
This test method is used to determine the ability of a polymer solder mask protective coating to withstand an environment conducive to electrochemical migration.
July 1, 2000
Resistance to Electrochemical Migration, Solder Mask
A description is not available for this item.
TM-650 2.6.14A
August 1, 1987
Resistance to Electromigration, Polymer Solder Mask
A description is not available for this item.