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IPC - TR-476

How to Avoid Metallic Growth Problems on Electronic Hardware

inactive
Organization: IPC
Publication Date: 1 September 1977
Status: inactive
Page Count: 54

Document History

May 1, 1997
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
This technical report discusses the reasons and the test methods available for electrically induced failures on printed wiring board surfaces and sub-surfaces caused by a combination of voltage...
TR-476
September 1, 1977
How to Avoid Metallic Growth Problems on Electronic Hardware
A description is not available for this item.
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