scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes, consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked device shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 27C2048 (128K × 16) UVEPROM 250 ns 02 27C2048 (128K × 16) UVEPROM 200 ns 03 27C2048 (128K × 16) UVEPROM 150 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be designated in MIL-STD-1835 as follows:

Outline letter Descriptive designator Terminals Package style 2/ Q GDIP1-T40 or CDIP2-T40 40 Dual-in-line package X CQCC1-N44 44 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Input or output voltage range with respect to ground . . . . . . . . . −0.6 V dc to V_CC +0.6 V dc Voltage on A9 with respect to ground . . . . . . . . . . . . . . . . . −0.6 V dc to +13.5 V dc V_PP supply voltage range with respect to ground during programming . . −0.6 V dc to +13.5 V dc V_CC supply voltage range with respect to ground . . . . . . . . . . . −0.6 V dc to +7.0 V dc Maximum power dissipation P_D . . . . . . . . . . . . . . . . . . . . . 330 mW Lead temperature (soldering, 10 sec.) . . . . . . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC): Case Q and X . . . . . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . . . . . . . . . +150°C 4/ Endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 cycles/byte, minimum Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 years, minimum

Case operating temperature range (T_C) . . . . . . . . . . . . . . . . . −55°C to +125°C Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . . . . 4.5 V dc to 5.5 V dc

Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . xx percent 5/

intended Use: