scope:

This standard prescribes practices and requirements for manufacture of soldered electrical and electronic assemblies.

Purpose

This standard describes materials, methods and verification criteria for producing quality soldered interconnections and assemblies. The intent of this document is to rely on process control methodology to ensure the manufacture of quality products. It is not the intent of this standard to exclude any acceptable procedure for component placement or for applying flux and solder used to make the electrical connection; however, the methods used must produce completed solder joints conforming to the acceptability requirements described in this standard.

The requirements for assembly, soldering, soldered connections, cleaning, coatinglencapsulation, rework, and verification are defined in general terms.