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IPC - J-STD-001

Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies

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Organization: IPC
Publication Date: 1 December 2010
Status: inactive
Page Count: 26
scope:

This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC J-STD-001E to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space.

Purpose When required by procurement documentation/drawings, this Addendum supplements or replaces specifically identified requirements of IPC J-STD- 001, Revision E of April 2010.

Document History

J-STD-001HA
October 1, 2021
Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001H to ensure the reliability of mission-critical soldered automotive...
J-STD-001HS
April 1, 2021
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001H to ensure the reliability of soldered electrical and electronic assemblies...
J-STD-001
September 1, 2020
Requirements for Soldered Electrical and Electronic Assemblies
This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology...
J-STD-001
February 1, 2020
Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001G and IPC-A-610G to ensure the reliability of mission-critical soldered...
J-STD-001
January 1, 2020
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies Amendment 1
A description is not available for this item.
J-STD-001
September 1, 2018
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001-S
March 1, 2018
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001G to ensure the reliability of soldered electrical and electronic assemblies...
J-STD-001
October 1, 2017
Requirements for Soldered Electrical and Electronic Assemblies
This Standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology...
J-STD-001-S
January 1, 2017
Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001F with Amendment 1 to ensure the reliability of soldered electrical and...
J-STD-001
November 1, 2015
Requirements for Soldered Electrical and Electronic Assemblies
This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document’s recommendations and...
J-STD-001
November 1, 2015
Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001
January 1, 2015
Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
A description is not available for this item.
J-STD-001
July 1, 2014
Requirements for Soldered Electrical and Electronic Assemblies
This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document's recommendations and...
J-STD-001
December 1, 2010
Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies
This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC J-STD-001E to ensure the reliability of soldered electrical and electronic...
J-STD-001
April 1, 2010
Requirements for Soldered Electrical and Electronic Assemblies
This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more...
J-STD-001
September 1, 2009
Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies Amendment 1
Scope This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a...
J-STD-001
April 1, 2008
Requirements for Soldered Electrical and Electronic Assemblies
Scope This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a...
J-STD-001DS ADD
November 1, 2006
Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
This addendum provides additional requirements over those published in IPC J-STD-001D to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and...
J-STD-001
May 26, 2005
Requirements for Soldered Electrical and Electronic Assemblies
Scope This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a...
J-STD-001
February 1, 2005
Requirements for Soldered Electrical and Electronic Assemblies
This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more...
J-STD-001
January 1, 2004
Space Applications Electronic Hardware Addendum to Requirements for Soldered Electrical and Electronic Assemblies
This addendum provides additional requirements over those published in IPC/EIA J-STD-001C to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration...
J-STD-001
March 1, 2000
Requirements for Soldered Electrical and Electronic Assemblies
This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more...
J-STD-001
October 1, 1996
Requirements for Soldered Electrical and Electronic Assemblies
This standard prescribes practices and requirements for manufacture of soldered electrical and electronic assemblies. Purpose This standard describes materials, methods and verification criteria...
J-STD-001
January 1, 1995
Requirements for Soldered Electrical and Electronic Assemblies
This standard prescribes requirements for soldered electrical and electronic assemblies. Purpose This standard describes materials, methods and verification criteria for producing quality soldered...
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References

This document is referenced by:
IPC-HDBK-850 - Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
Published by IPC on July 1, 2012
For the purpose of this document potting can be thought of as the ‘‘liquid material'' and encapsulation can be interpreted as the application process and cure. Please keep in mind however that the...
This document is referenced by:
ARINC 671 - GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
Published by ARINC on March 15, 2006
This report is focused on managing the maintenance and repair of soldered assemblies during the transition to lead-free technology. The terms lead-based and lead-free refer to alloys used in soldered...
This document is referenced by:
IEC/TS 62647-1 - Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 1: Preparation for a lead-free control plan
Published by IEC on August 1, 2012
This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing...
This document is referenced by:
NASA-STD-5005 REV D W/CHG 1 - STANDARD FOR THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT
Published by NASA on June 14, 2013
Purpose The purpose of this Standard is to establish requirements and guidance for design and fabrication of ground support equipment (GSE) to assist National Aeronautics and Space Administration...
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