IPC - TM-650 2.2.20
Solder Paste Metal Content by Weight
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | active |
| Page Count: | 2 |
scope:
This procedure determines the percent metal content for solder paste.
Document History
TM-650 2.2.20
January 1, 1995
Solder Paste Metal Content by Weight
This procedure determines the percent metal content for solder paste.