scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class 8 microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 80C86RH 16-Bit CMOS microprocessor radiation hardened

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style Q CDIP2-T40 40 Dual-in-line package X See figure 1 42 Flatpack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - - - - +7.0 V dc Input or output voltage range - - - - - - - - - - - - - - - - - V_SS−0.3 V dc to V_DD +0.3 V dc Storage temperature range (T_STG) - - - - - - - - - - - - - - - - −65°C to +150°C Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - +175°C Lead temperature (soldering 10 seconds) (T_S) - - - - - - - - - - +300 °C Thermal resistance junction-to-case (θ_JC): Case outline Q - - - - - - - - - - - - - - - - - - - - - - - 8.6°C/W Case outline X - - - - - - - - - - - - - - - - - - - - - - - 9.7°C/W Thermal resistance junction-to-ambient (θ_JA): Case outline Q - - - - - - - - - - - - - - - - - - - - - - - 40°C/W Case outline X - - - - - - - - - - - - - - - - - - - - - - - 72.1°C/W Maximum package power dissipation at T_A = +125°C (P_D) 2/ Case outline Q - - - - - - - - - - - - - - - - - - - - - - - 1.25 W Case outline X - - - - - - - - - - - - - - - - - - - - - - - 0.69 W

Operating supply voltage range (V_DD) - - - - - - - - - - - - - - 4.75 V dc to +5.25 V dc Operating temperature range (T_A) - - - - - - - - - - - - - - - - −35°C to +125°C Input low voltage range (V_IL) - - - - - - - - - - - - - - - - - 0 V dc to +0.8 V dc Input high voltage range (V_IH) - - - - - - - - - - - - - - - - - 3.5 V dc to V_DD Clock input low voltage range (V_ILC) - - - - - - - - - - - - - 0 V dc to +0.8 V dc CLK and MS/MX input high range (V_ILH) - - - - - - - - - - - - - V_DD − 0.8 V dc to V_DD Radiation features: Total dose - - - - - - - - - - - - - - - - - - - - - - - - - - > 100k Rads(SI) Transient upset - - - - - - - - - - - - - - - - - - - - - - - > 10⁸RAD (SI)/sec 3/ Single event upset - - - - - - - - - - - - - - - - - - - - - 6 MeV/(mg/cm²) 3/ Single event latchup - - - - - - - - - - - - - - - - - - - - - 75 MeV/(mg/cm²) 3/

intended Use: