ASTM International - ASTM F1893-98(2003)
Guide for Measurement of Ionizing Dose-Rate Burnout of Semiconductor Devices
| Organization: | ASTM International |
| Publication Date: | 10 May 1998 |
| Status: | inactive |
| Page Count: | 5 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
significance And Use:
The use of FXR radiation sources for the determination of high dose-rate burnout in semiconductor devices is addressed in this guide. The goal of this guide is to provide a systematic approach to... View More
scope:
1.1 This guide defines the detailed requirements for testing microcircuits for short pulse high dose-rate ionization-induced failure. Large flash x-ray (FXR) machines operated in the photon mode, or FXR e-beam facilities are required because of the high dose-rate levels that are necessary to cause burnout. Two modes of test are possible (1) survival test, and (2) A failure level test.
1.2 The values stated in International System of Units (SI) are to be regarded as standard. No other units of measurement are included in this standard.
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