scope:

This series of European Specifications specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die. This Specification also gives recommendations for general industry good practice in the use of bare die, with or without connection structures, and minimally-packaged die. ES 59008-4-2 specifies the requirements for the exchange of data needed for delivery, specifically handling and storage of unpackaged and minimally packaged semiconductor die. The standard also specifies the requirements for the exchange of data to control product traceability and change notification. Recommendation for general industry good practice for handling, storage and labelling are contained in Parts 5-1, 5-2 and 5-3 of ES 59008. This specification is for use by semiconductor manufactureres, suppliers, die processors and users of semiconductor die.