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IPC-TM-650 2.3.15

Purity, Copper Foil or Plating

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Organization: IPC
Publication Date: 1 May 2004
Status: active
Page Count: 2
scope:

This is an electrogravimetric method for determining the purity of copper foil or plating.

Document History

IPC-TM-650 2.3.15
May 1, 2004
Purity, Copper Foil or Plating
This is an electrogravimetric method for determining the purity of copper foil or plating.
August 1, 1997
Purity, Copper Foil or Plating
A description is not available for this item.
June 1, 1991
Purity of Copper Foil
A description is not available for this item.

References

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