scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q, and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes m RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type(s) Generic number Circuit function 01 100313 Low power quad driver

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP5-T24 or CDIP6-T24 24 dual-in-line package Y See figure 1 24 quad-flat package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Negative supply voltage range (V_EE) - - - - - - - - - - - - - −7.0 V dc to +0.5 V dc DC input voltage range (V_IN) - - - - - - - - - - - - - - - - - V_EE to +0.5 V DC input current range (I_IN) - - - - - - - - - - - - - - - - - −30mA to +5.0 mA Maximum dc output current (I_OUT) - - - - - - - - - - - - - - - −50 mA Storage temperature range - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - +300°C Junction temperature (T_J)- - - - - - - - - - - - - - - - - - - +175°C Maximum power dissipation (P_D) - - - - - - - - - - - - - - - - 500 mW Thermal resistance, junction-to-case (Θ_JC) - - - - - - - - - - See MIL-STD-1835

Negative supply voltage range (V_EE) - - - - - - - - - - - - - −5.7 V dc minimum to −4.2 V dc maximum High level input voltage range (V_IN) - - - - - - - - - - - - - −1165 V dc minimum to −870 V dc maximum Low level input voltage range (V_IL) - - - - - - - - - - - - - −1830 V dc minimum to −1475 V dc maximum Case operating temperature range (T_C) - - - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - 2/ percent

intended Use: