IPC - TM-650 2.6.3D
Moisture and Insulation Resistance, Rigid, Rigid/Flex and Flex Printed Wiring Boards
inactive
| Organization: | IPC |
| Publication Date: | 1 November 1988 |
| Status: | inactive |
| Page Count: | 5 |
Document History
May 1, 2004
Moisture and Insulation Resistance, Printed Boards
This test method is to determine the degradation of insulating materials by examination of the visual and electrical insulation resistance properties of printed board specimens after exposure to high...
August 1, 1997
Moisture and Insulation Resistance, Printed Boards
This test method is to determine the visual degradation and electrical insulation resistance of rigid printed wiring board specimens due to the deleterious effects of the high humidity, and the heat...
TM-650 2.6.3D
November 1, 1988
Moisture and Insulation Resistance, Rigid, Rigid/Flex and Flex Printed Wiring Boards
A description is not available for this item.