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IPC-TM-650 2.6.3

Moisture and Insulation Resistance, Printed Boards

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Organization: IPC
Publication Date: 1 May 2004
Status: active
Page Count: 4
scope:

This test method is to determine the degradation of insulating materials by examination of the visual and electrical insulation resistance properties of printed board specimens after exposure to high humidity and heat conditions. This method allows testing with (Method A) or without (Method B) Conformal Coating. When not specified, Method A is the default method.

 

Document History

IPC-TM-650 2.6.3
May 1, 2004
Moisture and Insulation Resistance, Printed Boards
This test method is to determine the degradation of insulating materials by examination of the visual and electrical insulation resistance properties of printed board specimens after exposure to high...
August 1, 1997
Moisture and Insulation Resistance, Printed Boards
This test method is to determine the visual degradation and electrical insulation resistance of rigid printed wiring board specimens due to the deleterious effects of the high humidity, and the heat...
November 1, 1988
Moisture and Insulation Resistance, Rigid, Rigid/Flex and Flex Printed Wiring Boards
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References

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