scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and Lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54F827 10-bit buffer/line driver

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat package L GDIP3-T24 or CDIP4-T24 24 Dual-in-line package 3 CQCC2-N28 28 Square chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input voltage range . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input current range . . . . . . . . . . . . . . . . . −30 mA to +5.0 mA Voltage applied to a disabled three-state output range . −0.5 V dc to +5.5 V dc Voltage applied to any output in the high state . . . . −0.5 V to V_CC Current into any output in the low state . . . . . . . . 96 mA Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Maximum power dissipation, (P_D) 2/. . . . . . . . . . . 450 mW Thermal resistance, junction-to-case (Θ_JC) . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . +175°C

Supply voltage range (V_CC) . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Minimum high-level input voltage (V_IH) . . . . . . . . . 2.0 V dc Maximum low-level input voltage (V_IL) . . . . . . . . . 0.8 V dc Maximum input clamp current (I_IK) . . . . . . . . . . . −18 mA Maximum high level output current (I_OH) . . . . . . . . −12 mA Maximum low level output current (I_OL) . . . . . . . . . +48 mA Case operating temperature range (T_C) . . . . . . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, method 5012) . . . . . . . . 3/ percent

intended Use: