scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 7892S Single supply 12-bit 600 KSPS ADC

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non- JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

V_DD to AGND .......................................... −0.3 V dc to +7 V dc V_DD to DGND .......................................... −0.3 V dc to +7 V dc Analog input voltage to AGND ......................... ±17 V dc Reference input voltage to AGND ...................... −0.3 V dc to V_DD + 0.3 V dc Digital input voltage to DGND ........................ −0.3 V dc to V_DD + 0.3 V dc Digital output voltage to DGND ....................... −0.3 V dc to V_DD + 0.3 V dc Power dissipation (P_D)................................ 450 mW Storage temperature range ............................ −65°C to +150°C Junction temperature (T_J) ............................ +150°C Lead temperature (soldering, 10 sec) ................. +300°C Thermal resistance, junction-to-ambient (θ_JA)......... 70°C/W

Ambient operating temperature range (T_A) ............. −55°C to +125°C

intended Use: