scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

UVLO UVLO Device type Generic number Circuit function Turn-on Turn-off 01 UC1875 Phase shift resonant controller 10.75 V 9.25 V

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line X CQCC1-N28B 28 Square leadless chip carrier with thermal pads 3 CQCC1-N28 28 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage (V_C, V_IN) .................................. 20 V Output current, source or sink: DC ....................................................... 0.5 A Pulse (0.5 µs) ............................................ 3 A Analog I/O pins ............................................ −0.3 V to 5.3 V Operating junction temperature (T_J) ........................ 150°C Storage temperature range .................................. −65°C to +150°C Lead temperature (soldering, 10 seconds) ................... 300°C Thermal resistance, junction-to-case (Θ_JC) ................. See MIL-STD-1835 Thermal resistance, junction-to-ambient(Θ_JA): Case R .................................................... 85°C/W Cases X and 3 ............................................ 65°C/W

Supply voltage (V_C, V_IN) .................................. 12 V Ambient operating temperature (T_A) ........................ −55°C to + 125°C

intended Use: