scope:

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

Part or Identifying Number (PIN). The complete PIN is as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Propagation Delay 01 128-Macrocell EPLD 35 ns 02 128-Macrocell EPLD 30 ns 03 128-Macrocell EPLD 25 ns 04 128-Macrocell EPLD 20 ns 05 128-Macrocell EPLD 15 ns

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA15-PN 68 pin grid array package 2/ Y GQCC1-J68 68 J-leaded chip carrier 2/ Z See figure 1 68 quad flat package 2/

The lead finish is as specified in MIL-PRF-38535, appendix A.

Supply voltage to ground potential 2.0 V dc to +7.0 V dc DC Input voltage 2.0 V dc to +7.0 V dc Maximum power dissipation 3/ 2.5 W Lead temperature (soldering, 10 seconds) +260°C Thermal resistance, junction-to-case (θ_JC): Case outlines X and Y See MIL-STD-1835 Case outline Z 10°C/W 4/ Junction temperature (T_j) +175°C Storage temperature range −65°C to +150°C Temperature under bias −55°C to +125°C Endurance 25 erase/write cycles (minimum) Data retention 10 years minimum

Supply voltage (V_CC) ----------------------- +4.5 V dc to +5.5 V dc Ground voltage (GND) ----------------------- 0 V dc Input high voltage (V_IH) ------------------- 2.2 V dc minimum Input low voltage (V_IL) -------------------- 0.8 V dc maximum Case operating temperature range (T_C) ------ −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.