scope:

This drawing form a part of one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-14-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 MN7130 Multiplexed track and hold amplifier

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation H or K Certification and qualification to MIL-H-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 32 Dual-in-line

The teed finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Positive supply voltage (+V_CC) . . . . . . . . . . . . +16 V dc Negative supply voltage (−V_CC) . . . . . . . . . . . . −16 V dc Multiplexer inputs (pins 1 through 16). . . . . . . . . −V_CC to +V_CC Instrumentation amp inputs (pins 21 and 22) . . . . . . ±15 V T/H amplifier input (pin 19) . . . . . . . . . . . . . 0 to ±V_CC Address inputs (pins 27 through 31) . . . . . . . . . . −0.3V to +V_CC T/H command input (pin 17) . . . . . . . . . . . . . . 0 to +7 V Power dissipation (P_D) . . . . . . . . . . . . . . . . 1200 mW Thermal resistance (θ_JC) . . . . . . . . . . . . . . . 5°C/W Thermal resistance (θ_JA) . . . . . . . . . . . . . . . 28°C/W Lead temperature (soldering, 10 seconds) . . . . . . . +300°C Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Junction temperature (T_J) . . . . . . . . . . . . . . +175°C

Positive supply voltage range (+V_CC). . . . . . . . . . +14.55 V dc to +15.45 V dc Negative supply voltage range (−V_CC). . . . . . . . . . −155 V dc to −15.45 V dc Ambient operating temperature range (T_J). . . . . . . . −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.