scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 4013B Dual D type flip-flop 02 4013B Dual D type flip-flop 03 14013B Dual D type flip-flop

The case outline shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C CDIP2-Tl4 or GDIP1-Tl4 14 Dual-in-line package D CDFP2-Fl4 or GDFP1-F14 14 flat-package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_DD) - - - - - - - - - −0.5 V dc to +18 V dc Input voltage range - - - - - - - - - - - - −0.5 V dc to V_DD +0.5 V dc Storage temperature range - - - - - - - - - −65°C to +150°C Maximum power dissipation per device (P_D) 1/- - 500 mW 2/ Lead temperature (soldering 10 seconds)- - - +300°C Thermal resistance, junction to case (O_JC) - See MIL-STD-1835 Junction temperature (T_J) - - - - - - - - - +175°C

Supply voltage - - - - - - - - - - - - - - - +3.0 V dc to +15 V dc Case operating temperature range - - - - - - −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.