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IEEE 1386

Common Mezzanine Card (CMC) Family

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Organization: IEEE
Publication Date: 14 June 2001
Status: inactive
Page Count: 61
scope:

This standard defines the mechanics for a common set of slim mezzanine cards that can be used on VME, VME64 and VME64x boards, CompactPCI® boards, Multibus® I and II boards; desktop computers; portable computers; servers; and other similar computer applications. Mezzanine cards based on this standard can be used to provide modular front panel I/O, backplane I/O, or general function expansion for the host computer.

Document History

IEEE 1386.1
June 14, 2001
Standard Physical and Environmental Layers for PCI Mezzanine Cards (PMC)
A description is not available for this item.
IEEE 1386
June 14, 2001
Common Mezzanine Card (CMC) Family
This standard defines the mechanics for a common set of slim mezzanine cards that can be used on VME, VME64 and VME64x boards, CompactPCI® boards, Multibus® I and II boards; desktop computers;...

References

This document references:
IEEE 1101.10 - Standard for Additional Mechanical Specifications for Microcomputers Using the IEEE Std 1101.1-1991 Equipment Practice
Published by IEEE on December 10, 1996
This generic standard may be applied in all fields of electronics where equipment and installations are required to conform to the 482.6 mm (19 in) equipment practice based on IEEE Std 1101.1-1991,...
This document references:
IEC 60917-2-1 - Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 1: Detail specification - Dimensions for cabinets and racks
Published by IEC on November 1, 1993
This section of IEC 917-2 is a detail specification which is to be used in whole or in part in all fields of electronics where devices and systems are designed according to the sectional...
This document references:
61587-1 - Mechanical structures for electrical and electronic equipment – Tests for IEC 60917 and IEC 60297 series – Part 1: Environmental requirements, test setups and safety aspects
Published by IEC on January 1, 2022
This part of IEC 61587 specifies environmental requirements, test set-ups, as well as safety aspects for empty enclosures, i.e. cabinets, racks, subracks, chassis, chassis integrated subracks and...
This document references:
IEEE 1014 - Standard for a Versatile Backplane Bus: VMEbus
Published by IEEE on March 12, 1987
Abstract This IEEE 1014 standard specifies a high-performance backplane bus for use in microcomputer systems that employ single or multiple microprocessors. It is based on the VMEbus specification,...
This document references:
IEEE 1101.1 - Standard for Mechanical Core Specifications for Microcomputers Using IEC 60603-2 Connectors
Published by IEEE on September 30, 1998
Basic dimensions of subracks This standard covers the basic dimensions of a range of modular subracks conforming to IEC 60297-3 (1984-01) and IEC 60297-4 (1995-03) for mounting in equipment according...
This document references:
IEEE 1101.10 - Standard for Additional Mechanical Specifications for Microcomputers Using the IEEE Std 1101.1-1991 Equipment Practice
Published by IEEE on December 10, 1996
This generic standard may be applied in all fields of electronics where equipment and installations are required to conform to the 482.6 mm (19 in) equipment practice based on IEEE Std 1101.1-1991,...
This document is referenced by:
IEC 61189-5-502 - Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 5-502: General test methods for materials and assemblies – Surface Insulation Resistance (SIR) testing of assemblies
Published by IEC on February 1, 2021
This part of IEC 61189 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of...
This document is referenced by:
EN IEC 61189-5-502 - Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies
Published by CENELEC on March 1, 2021
This part of IEC 61189 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of...
This document is referenced by:
BS EN IEC 61189-5-502 - Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 5-502: General test methods for materials and assemblies — Surface insulation resistance (SIR) testing of assemblies
Published by BSI on March 31, 2021
A description is not available for this item.
This document is referenced by:
EN IEC 61189-5-502 - Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies
Published by CEI on October 1, 2021
This part of IEC 61189 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of...
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