GMNA - 9984830
Primer - Rigid, Nonconductive, for Thermoplastics
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| Organization: | GMNA |
| Publication Date: | 1 February 1989 |
| Status: | inactive |
| Page Count: | 1 |
scope:
1 SCOPE.
This specification covers the requirements for a rigid, nonconductive primer for thermoplastics. The primer shall provide a smooth, adhesion promoting surface for application of subsequent coatings. The primer must be sandable, have the abiity to fill minor surface imperfections in the substrate, and act as a barrier to prevent popping of topcoats during subsequent bakes.
Document History
April 1, 2022
High Bake, Solventborne Non-Conductive Rigid Primer for Plastics
This specification covers the requirements for a rigid, nonconductive primer for thermoplastics. The primer shall provide a smooth, adhesion promoting surface for application of subsequent coatings....
September 1, 2021
High Bake, Solventborne Non-Conductive Rigid Primer for Plastics
This specification covers the requirements for a rigid, nonconductive primer for thermoplastics. The primer shall provide a smooth, adhesion promoting surface for application of subsequent coatings....
October 1, 2016
High Bake, Solventborne Non-Conductive Rigid Primer for Plastics
This specification covers the requirements for a rigid, nonconductive primer for thermoplastics. The primer shall provide a smooth, adhesion promoting surface for application of subsequent coatings....
May 1, 2009
High Bake, Nonconductive Rigid Primer for Plastics
This specification covers the requirements for a rigid, nonconductive primer for thermoplastics. The primer shall provide a smooth, adhesion promoting surface for application of subsequent coatings....
October 1, 2005
Primer - Rigid, Nonconductive, for Thermoplastics
A description is not available for this item.
9984830
February 1, 1989
Primer - Rigid, Nonconductive, for Thermoplastics
1 SCOPE. This specification covers the requirements for a rigid, nonconductive primer for thermoplastics. The primer shall provide a smooth, adhesion promoting surface for application of subsequent...