scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Relative accuracy 01 MAX500A Quad serial 8-bit D/A converter ±½ LSB 02 MAX500B Quad serial 8-bit D/A converter ±1 LSB

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V_DD to AGND - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc, +17 V dc V_DD to DGND - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc, +17 V dc V_SS to DGND - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −7 V dc, V_DD + 0.3 V dc V_DD to V_SS - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc, +24 V dc Digital input voltage to DGND - - - - - - - - - - - - - - - - - - - - - −0.3 V dc, V_DD + 0.3 V dc V_REF to AGND - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc, V_DD + 0.3 V dc V_OUT to AGND 2/ - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc, V_DD + 0.3 V dc Power dissipation (P_D), T_A = +70°C 3/: Case outline E - - - - - - - - - - - - - - - - - - - - - - - - - - - 800 mW Case outline 2 - - - - - - - - - - - - - - - - - - - - - - - - - - - 727 mw Storage temperature range - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering 10 sec) - - - - - - - - - - - - - - - - - - +300°C Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - - - - +150°C Thermal resistance, junction-to-case (θ_JC) - - - - - - - - - - - - - - See MIL-STD-1835 Thermal resistance, junction-to-ambient(θ_JA): Case outline E - - - - - - - - - - - - - - - - - - - - - - - - - - - 100°C/W Case outline 2 - - - - - - - - - - - - - - - - - - - - - - - - - - - 110°C/W

Positive supply voltage (V_DD): Dual supply operation - - - - - - - - - - - - - - - - - - - - - - - - +11.4 V dc to +16.5 V dc Single supply operation - - - - - - - - - - - - - - - - - - - - - - - +14.25 V dc to +15.75 V dc Ambient operating temperature range (T_A) - - - - - - - - - - - - - - - −55°C to +125°C

intended Use: