scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 AD676 16 Bit, analog to digital converter with parallel interface

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V_CC to V_EE . . . . . . . . . . . . . . . . . . . . . . −0.3 V to +26.4 V V_DD to DGND . . . . . . . . . . . . . . . . . . . . . . −0.3 V to +7 V V_CC to AGND . . . . . . . . . . . . . . . . . . . . . . −0.3 V to +18 V V_EE to AGND . . . . . . . . . . . . . . . . . . . . . . −18 V to +0.3 V AGND to DGND . . . . . . . . . . . . . . . . . . . . . ±0.3 V Digital inputs (CAL, SAMPLE, CLK,) to DGND . . . . . . D V to +5.5 V Analog inputs (V_IN, V_REF, AGND SENSE) to AGND . . . . . (V_CC + 0.3 V) to (V_EE − 0.3 V) Power dissipation (P_D): 10 V . . . . . . . . . . . . . . . . . . . . . . . . 630 mW 5 V . . . . . . . . . . . . . . . . . . . . . . . . . 480 mW Storage temperature range . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JA) . . . . . 60°C/W

Positive analog supply voltage (V_CC) . . . . . . . . . 11.4 V to 12.6 V Negative analog supply voltage (V_EE) . . . . . . . . . −11.4 V to −12.6 V Digital supply voltage (V_DD) . . . . . . . . . . . . . 4.5 V to 5.5 V Analog reference voltage (V_REF) . . . . . . . . . . . . 5 V to 10 V Analog input voltage range (V_IN) . . . . . . . . . . . −V_REF to V_REF Analog ground sense voltage . . . . . . . . . . . . . . −0.1 V to 0.1 V Ambient operating temperature range (T_A) . . . . . . . −55°C to +125°C

intended Use: