DLA - SMD-5962-90737 REV B
MICROCIRCUIT, LINEAR, ANALOG SWITCH, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 24 March 1995 |
| Status: | inactive |
| Page Count: | 13 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 DG417A CMOS, SPST analog switch 02 DG418A CMOS, SPST analog switch 03 DG419A CMOS, SPST analog switch
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 dual-in-line H GDFP1-F10 or CDFP2-F10 10 flat package X CDFP3-F10 10 flat package
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage between V+ and V− . . . . . . . . . . . . . 44 V dc Supply voltage between GND and V− . . . . . . . . . . . . 25 V dc Digital inputs range to V− . . . . . . . . . . . . . . . (GND −0.3 V dc) to 44 V dc 2/ Digital input range VS, VD to V− . . . . . . . . . . . . (V−) −2.0 V dc to (V+) +2.0 V dc or 30 mA, whichever occurs first 2/ Current (any terminal except for S or D) continuous . . . . 30 mA Current (S or D)pulsed, 1.0 ms, 10% duty cycle . . . . . . 100 mA Storage temperature range . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . +300°C Power dissipation, (PD): Case P, at +75°C . . . . . . . . . . . . . . . . . . . . 600 mW 3/ Case H and X, at +70°C . . . . . . . . . . . . . . . . . 421 mW 3/ Thermal resistance, junction-to-case (ΘJC) . . . . . . . . See MIL-STD-1835 Junction temperature (TJ) . . . . . . . . . . . . . . . . . +175°C
Positive supply voltage (V+) . . . . . . . . . . . . . . +15 V dc Negative supply voltage (V−) . . . . . . . . . . . . . . −15 V dc Logic supply voltage (VL) . . . . . . . . . . . . . . . . . 5 V dc Ambient operating temperature range (TA) . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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