scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 AD9002S High speed 8-bit A/D converter 02 AD9002T High speed 8-bit A/D converter

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 dual-in-line 3 CQCCI-N28 28 square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without reference.

Negative supply voltage (V_S−)- - - - - - - - - - - −6 V dc Analog input voltage - - - - - - - - - - - - - - - V_S− to +0.5 V dc Power dissipation (P_D), T_A = +25°C - - - - - - - - 1.2 W Storage temperature range - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 sec) - - - - - - - +300°C Junction temperature (T_J)- - - - - - - - - - - -.- +175°C Thermal resistance, junction-to-case (θ_JC) - - - - See MIL-STD-1835 Thermal resistance, junction-to-ambient (θ_JA): Case outline X - - - - - - - - - - - - - - - - 56°C/W Case outline 3 .- - - - - - - - - - - - - - - - 69°C/W ENCODE to [E bar][N bar][C bar][O bar][D bar][E bar] differential voltage - - - - - - 4.0 V dc Reference input voltage (+V_REF, −V_REF) 2/- - - - - −3.5 to +0.1 V dc Reference midpoint current - - - - - - - - - - - - ±4.0 mA Digital output current - - - - - - - - - - - - - - 20 mA Differential reference voltage - - - - - - - - - - 2.1 V dc Digital input voltage - - - - - - - - - - - - - - −V_S to 0 V dc Analog to digital supply voltage differential- - - 0.5 V dc

Ambient operating temperature range (T_A) - - - - - −55°C to +125°C Differential reference voltage - - - - - -.- - - - 2.0 V dc Negative supply voltage (V_S−)- - -.- - - - - - - - −5.2 V dc

intended Use: