scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and Appendix F of MIL-PRF-38535, "General provisions for TAB microcircuits" and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-)indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 320C30 Digital signal processor, 28 MHz 02 320C30 Digital signal processor, 25 MHz 03 320C30 Digital signal processor, 33 MHz 04 320C30 Digital signal processor, 40 MHz 05 320C30 Digital signal processor, 50 MHz

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A and appendix F of MIL-PRF-38535. Q or V Certification and qualification to MIL-PRF-38535 and Appendix F of MIL-PRF- 38535.

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outlines letter Descriptive designator Terminals Package style U See figure 1 196 Quad flat package with non-conductive tiebar X CMGA7-P181 181 Pin grid array Y 1/ See figure 1 196 Leadless chip carrier Z 1/ See figure 1 196 Quad flat package T See figure 1 203 Environmentally protected tape automated bond M See figure 1 196 Tape automated bond

The lead finish is as specified in MIL-PRF-38535 and Appendix F of MIL-PRF-38535, for device classes Q and V or MIL-PRF-38535, appendix A and Appendix F of MIL-PRF-38535 for device class M.

Supply voltage range (V_DD) _3/ ..................... −0.3 V dc to 7.0 V dc Input voltage range ............................... −0.3 V dc to 7.0 V dc Output voltage range .............................. −0.3 V dc to 7.0 V dc Continuous power dissipation 4/ ................... 3.15 W Storage temperature range ......................... −55°C to +150°C Thermal resistance, junction to case (Θ_JC): Case X ............................................ See MIL-STD-1835. Case U ............................................ 1.5°C/W Maximum die temperature rise for the die at 100% Cases T and M ..................................... 0.09°C/W Thermal resistance, junction to ambient (Θ_JA): Case U............................................. 29°C/W

Supply voltages (V_DD): Device type 01, 04 and 05 ......................... 4.75 V dc min to 5.25 V dc max Device type 02 and 03 ............................. 4.5 V dc min to 5.5 V dc max Supply voltages (CVSS, etc.)(V_SS) .................. 0 V dc nominal High level input voltage (V_IH) 5/ .................. 2.1 V dc min to V_DD +0.3 V dc max Low level input voltage (V_IL) 5/ ................... −0.3 V dc min to 0.8 V dc max High level output current (I_OH) .................... −300 µA max Low level output current (I_OL) ..................... 2 mA max CLKIN high level input voltage (V_TH) 5/............. 3.0 V dc Min to V_DD +0.3 V dc max Operating case temperature (T_C) .................... −55°C min to +125°C max

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ....... XX percent 6/