IPC-TM-650 2.4.25
Glass Transition Temperature and Cure Factor by DSC
inactive
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| Organization: | IPC |
| Publication Date: | 1 December 1994 |
| Status: | inactive |
| Page Count: | 3 |
scope:
This test method is designed to determine the glass transition temperature of dielectric materials used in printed boards by differential scanning calorimetry (DSC). It is suitable for prepreg, metallic clad or unclad laminate, and printed boards. It also provides a determination of relative degree of cure, or Cure Factor, for some types of materials.
Document History
November 1, 2017
Glass Transition Temperature and Cure Factor by DSC
This test method is designed to determine the glass transition temperature of dielectric materials used in printed boards by differential scanning calorimetry (DSC). It is suitable for prepreg,...
IPC-TM-650 2.4.25
December 1, 1994
Glass Transition Temperature and Cure Factor by DSC
This test method is designed to determine the glass transition temperature of dielectric materials used in printed boards by differential scanning calorimetry (DSC). It is suitable for prepreg,...