scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 733 Two-stage, differential input, differential output video amplifier 02 592 Two-stage, differential input, differential output video amplifier 03 TL027 Two-stage, differential input, differential output video amplifier

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line H GDFP1-F10 or CDFP2-F1O 10 Flat pack I MACY1-X10 10 Can 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Positive supply voltage (+V_CC) . . . . . . . . . . . . . . +8 V dc Negative supply voltage (−V_CC) . . . . . . . . . . . . . . −8 V dc Differential input voltage . . . . . . . . . . . . . . . ±5 V dc Common mode input voltage: . . . . . . . . . . . . . . . . ±6 V dc Output current . . . . . . . . . . . . . . . . . . . . . . 10 mA Power dissipation (P_D) . . . . . . . . . . . . . . . . . . 500 mW 1/ Junction temperature (T_J) . . . . . . . . . . . . . . . . . 150°C Storage temperature range . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . 300°C Thermal resistance, junction-to-ambient (Θ_JC) . . . . . . . See MIL-STD-1835

Ambient operating temperature range (T_A) . . . . . . . . . −55°C to +125°C

intended Use: