DLA - SMD-5962-90809 REV B
MICROCIRCUIT, LINEAR, JFET, MICROPOWER, QUAD, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 17 June 1994 |
| Status: | inactive |
| Page Count: | 14 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class N RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 TLE2064 JFET-input, high-output-drive micropower quad operational amplifier 02 TLE2064A JFET-input, high-output-drive micropower quad operational amplifier
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage +VCC 2/ . . . . . . . . . +19 V Supply voltage −VCC . . . . . . . . . . . . . . . . −19 V Differential input voltage 3/ . . . . . . ±38 V Input voltage range, VI (any input) 2/ . . . . . . . ±VCC Input current, II (each input) . . . . . . . . . . . ±1 mA Output current, IO (each output) . . . . . . . . . . ±80 mA Total current into +VCC terminal . . . . . . . . . . 80 mA Total current into −VCC terminal . . . . . . . . . . 80 mA Duration of short circuit current at (or below) +25°C . . . . . . . . . . . . . . . . . Unlimited 4/ Power dissipation (PD) Cases C and 2 . . . . . . . . . . . . . . . . . . . 1375 mW 5/ Case D . . . . . . . . . . . . . . . . . . . . . . 675 mW 5/ Junction temperature . . . . . . . . . . . . . . . . +150°C Storage temperature range . . . . . . . . . . . . . . −65°C to +150°C Case temperature for 60 seconds: case 2 . . . . . . +260°C Lead temperature 1.6 mm (1/16 inch) from case for 60 seconds Case C . . . . . . . . . . . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (ΘJC) . . . . . See MIL-STD-1835
Supply voltage (±VCC) . . . . . . . . . . . . . . . . . . . ±3.5 V minimum, ±18 V maximum Common-mode input voltage (VIC), ±VCC = ±5 V . . . . . . . −1.6 V minimum, 4 V maximum ±VCC = ±15 V . . . −11 V minimum, 13 V maximum Operating free-air temperature (TA) . . . . . . . . . . . . −55°C to +125°C
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