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NPFC - MIL-C-49464

CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

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Organization: NPFC
Publication Date: 25 June 1992
Status: inactive
Page Count: 24
scope:

This specification covers established reliability, ceramic plate, single layer, capacitors. These capacitors are intended for stripline or microstrip applications, usually at frequencies of 1 GHz and higher. Capacitors covered by this specification have failure rate levels ranging from 1.0 to 0.001 percent per 1,000 hours. These failure rate levels are established at a 90-percent confidence level and maintained at a 10-percent producer's risk. They are based on life tests performed at maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature. A parts per million (PPM) quality system is used for documenting and reporting the average outgoing quality of capacitors supplied to this specification. Statistical Process Control (SPC) techniques are required in the manufacturing process to minimize variation in production of capacitors

The term Part or Identifying Number (PIN) is equivalent to the term (part number, identification number, type designator) which was previously used in this specification. Capacitors specified herein shall be identified by a military PIN which shall consist of the basic number of the military specification sheet followed by a series of coded characters. Each military specification sheet covers a different capacitor style. The coded number shall provide information concerning the capacitor's temperature coefficient, slash sheet number, case code, dash number, capacitance tolerance and termination finish. The PIN shall be in the following form, and as specified (see 3.1).

The rated temperature and temperature coefficient limits are identified by a single letter. The rated temperature of these parts is −55°C to +125°C; the letter indicates the temperature coefficient limits as shown in table I. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commander, US Army Laboratory Command, (LABCOM), ATTN: SLCET-RS, Fort Monmouth, NJ 07703-5302 by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. TABLE I. Temperature coefficient limits.

Symbol PPM/°C Class Symbol PPM/°C Class --------------------------------------------------------------------- E +90 ±30 1A S −2400 ±1000 1B F 0 ±15 1A T −3300 ±1000 1C G 0 ±30 1A U −3900 ±1000 1C N −750 ±250 1B V −4700 ±1000 1C P −1500 ±500 1B X ±15% 2 R −2200 ±600 1B Y ±25% 2 Z +22 −82% 3 1/ 1/ Temperature coefficient measured between +10°C and +85°C.

The case code is identified by a single letter (see 3.1).

The dash number shall represent a specific capacitance value, voltage and failure rate level (see table II and 3.1). TABLE II. Failure rate level (established at 90 percent confidence).

Symbol Failure rate level (% per 1,000 hours) ------------------------------ M 1.0 P 0.1 R 0.01 S 0.001

The capacitance tolerance is identified by a single letter as shown in table III. TABLE III. Capacitance tolerance.

Symbol Capacitance tolerance -------------------------------- P ±.01 pF A ±.05 pF B ±.10 pF C ±.25 pF D ±.50 pF F ±1 percent G ±2 percent J ±5 percent K ±10 percent M ±20 percent V −0 +100 percent Z −20 + 80 percent

The termination finish shall be identified by either the letter "N" or "P". The letter "N" shall identify a termination suitable for solder attachment (see 3.5.2). The letter "P" shall identify a termination suitable for attachment by conductive epoxy or eutectic methods (see 3.5.2).

intended Use:

Single plate ceramic capacitors are intended for stripline or microstrip applications, usually at frequencies of 1 GHz and higher.

Document History

November 22, 2019
CAPACITOR, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
July 28, 2017
CAPACITOR, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
This specification covers the general requirements for ceramic plate, single layer capacitors. These capacitors are intended for stripline or microstrip applications, usually at frequencies of 1 GHz...
June 24, 2009
CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
This specification covers the general requirements for ceramic plate, single layer capacitors. These capacitors are intended for stripline or microstrip applications, usually at frequencies of 1 GHz...
June 3, 2004
CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
This specification covers the general requirements for ceramic plate, single layer capacitors. These capacitors are intended for stripline or microstrip applications, usually at frequencies of 1 GHz...
November 26, 2001
CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
September 30, 1997
CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
August 3, 1993
CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-49464
June 25, 1992
CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
This specification covers established reliability, ceramic plate, single layer, capacitors. These capacitors are intended for stripline or microstrip applications, usually at frequencies of 1 GHz and...
April 18, 1991
CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
March 22, 1989
CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
May 12, 1988
CAPACITORS, CHIP, SINGLE LAYER, FIXED, PARALLEL PLATE, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.

References

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