scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 HS-139RH Radiation hardened quad voltage comparator

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C CDIP2-T14 14 Dual-in-line X CDFP3-F14 14 Flat pack

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (+V) .................................. 36 V dc Input voltage range (V_IN) .................................. −0.3 V dc to 36 V dc Input current (V_IN)(V_IN < −0.3 V) 2/ ....................... 50mA Output short circuit duration (single supply) 3/ ........... Continuous Maximum storage temperature range .......................... −65°Cto 150°C Maximum power dissipation (P_D): Case outline C............................................. 0.67 W Case outline X............................................. 0.43 W Lead temperature (soldering, 10 seconds).................... +265°C maximum Junction temperature (T_J) .................................. +175°C maximum Thermal resistance, junction-to-case (Θ_JC): Case outline C............................................. 22°C/W Case outline X............................................. 28°C/W Thermal resistance, junction-to-ambient (Θ_JA): 4/ Case outline C............................................. 75°C/W Case outline X............................................. 115°C/W

Supply voltage range (+V) .................................. 5 V dc to 30 V dc Ambient operating temperature range (T_A) .................... −55° C to +125°C Radiation features: SEP effective let no upsets................................ 5/ Total Dose ................................................ > 300 Krads (SI) Dose rate upset ........................................... > × 10⁸ Rad (Si) / s Latch Up .................................................. None 6/

intended Use: