scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 8397BH 12 MHz 16-bit microcontroller with 8K bytes of on-chip ROM.

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style Z CMGA3-PN 68 pin grid array

The lead finish shall be as specified in MIL-M-38510 for classes M. B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall riot be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage Temperature Range .................................. −65°C to +150°C Voltage on Any Pin with respect to Ground (expect [E bar][A bar])....... −0.3 V dc to +7 V dc Voltage from EA to V_SS or ANGND............................. −0.3 V dc to +13.0 V dc Average output current from any pin......................... 10 mA Power Dissipation (P_D) ..................................... 1.5 W 1/ Lead Temperature (soldering 10 seconds)..................... 300°C Thermal Resistance, Junction-to-case (O_JC).................. 3.5°C/W Junction Temperature (T_J) .................................. 150°C

Case Operating Temperature Range ................ −55°C to +125°C 2/ Supply Voltages V_CC, V_REF, V_PD................... 4.5 V dc to 5.5 V dc Oscillator frequency, f_OSC....................... 6.0 to 12 MHz

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - XX percent 3/

intended Use: