DLA - SMD-5962-90765
MICROCIRCUIT, LINEAR, LINE DRIVER, QUAD DIFFERENTIAL, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 1 August 1991 |
| Status: | inactive |
| Page Count: | 18 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits-repres
The PIN shall be as shown in the following example:
Device classes M, B, and S RHA marked devices shall meet the mil-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 96F172 RS-485 comparable quad differential line driver 02 96F174 RS-485 comparable quad differential line driver
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535
For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-M-38535, appendix C of MIL-M-38510, and as listed below.
Outline letter Case outline E D-2 (16-lead, .860" × .310" × .200"), dual-in-line package F F-5 (16-lead, .440" × .285" × .085"), flat package 2 C-2 (20-terminal, .358" .358" × .100"), square chip carrier package
The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VCC) - - - - - - - - - - - - - 7 V dc
Enable input voltage - - - - - - - - - - - - - 5.5 V dc
Storage temperature range- - - - - - - - - - - −65°C to +150°C
Lead temperature (soldering, 60 seconds) - - - +300°C
Junction temperature (TJ)- - - - - - - - - - - +175°C
Power dissipation (PD): (TA = +25°C)
Case E - - - - - - - - - - - - - - - - - - - 1800 mW
Case F - - - - - - - - - - - - - - - - - - - 1000 mW
Case 2 - - - - - - - - - - - - - - - - - - - 2000 mW
Thermal resistance, junction-to-case(ΘJC)- - - See MIL-M-38510, appendix C
Thermal resistance, junction-to-ambient(
Operating supply voltage range (VCC) - - - - - 4.5 V dc to 5.5 V dc Ambient operating temperature range (TA) - - - −55°C to +125°C Common mode output voltage range (VOC) - - - - −7 V dc to +12 V dc High output current (IOH) - - - - - - - - - - −60 mA Low output current (IOL) - - - - - - - - - - - 60 mA
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Microcircuits... View More
Document History